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A1/1+4: Thermodynamic investigations of lead-free solder materials | Mikula, Prof. Adolf
mikula@ap.univie.ac.at Inst. f. Anorganische Chemie, Universität Wien, Währingerstr. 42 A-1090 Wien |
emf measurements, calorimetric measurements,
oxidation behavior |
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A2/1+2: Interaction of the lead-free solder systems Ag-Sn and Ag-Cu-Sn with Ni as contact material: Thermochemical and electrical properties, related phase diagrams and thermochemical calculations | Flandorfer, Dr. Hans
hans.flandorfer@univie.ac.at Inst. f. Anorganische Chemie, Universität Wien, Währingerstr. 42 A-1090 Wien |
calorimetric measurements;
emf-measurements; DTA; XRD; EPMA; phase diagram calculations |
diffusion measurements;
physical properties; corrosion |
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A5/1+3: Interactions of lead-free solders with Ti-containing metallizations | Schuster, Prof. Julius C.
julius.schuster@univie.ac.at Institut für Physikalische Chemie Universität Wien Währingerstr. 42 A-1090 Wien |
interaction between Sn- and In-based solders
and Ti-containing metallizations;
loss of adhesion; wetting behavior |
reflow and wave soldering under near industry
conditions;
adhesion testing; mechanical testing |
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BG1/1+2+3: Phase Diagrams of potential lead-free solders | Vassilev, Prof. Gueorgui P.
gpvassilev@excite.com University of Sofia Faculty of Chemistry 1, J. Bourchier Ave. BG-1164 Sofia |
Thermodynamics;
microstructure; physical and mechanical properties (surface tension, density, viscosity, thermal fatigue); electrical properties; Ti-containing solders |
preparation of materials |
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D12/1+3: Investigation of quaternary additions to Sn-Ag-Cu solders | Wielage, Prof. Bernhard
info@wsk.tu-chemnitz.de Lehrstuhl für Verbundwerkstoffe Fakultät für Maschinenbau und Verfahrenstechnik TU Chemnitz D-09107 Chemnitz |
Cu-Ag-Sn+M (M=Ni, Pd, Au, Fe, Mg);
wetting; thermodynamics; DTA; microstructure; SEM, TEM; long-time exposure at 120°C, 150°C |
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D14/1: Crystal structures of intermetallics in lead-free solder joints | Grin, Dr. Yuri
grin@cpfs.mpg.de Max Planck-Institut für Chemische Physik fester Stoffe Nöthnitzer Str. 40 D-01187 Dresden |
crystal structure;
X-ray diffraction (powder and single crystals) | |
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F1/1+2: Multicomponent phase equilibria studies in the systems based on Sb-Zn binaries. Experimental study and modelling | Record, Dr. Marie-Christine
record@lpmc.univ-montp2.fr Lab. de Physico-chimie de la Matière Condensée UMR CNRS 5617, cc03 Université Montpellier II Place E. Bataillon F-34095 Montpellier |
M-Sb-Zn: X-ray, DTA, DSC, EMPA, metallographie;
phase diagram calculations |
(cooperation with D1/2, D2/2+1) |
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F2/1+2: Experimental and calculate phase diagram Au-Ag-Bi-Sb | Legendre, Prof. Bernard
F |
Au-Ag-Bi, Au-Ag-Sb, Au-Bi-Sb: DSC, X-ray, metallography, EPMA | |
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F3/1+2: Phase Diagrams of potential lead-free solders | Tédenac, Prof. Jean-Claude
tedenac@lpmc.univ-montp2.fr Univ. of Montpellier 2 Lab. de Physico-Chimie de la Matiére Condensée Pl. E. Bataillon F-34095 Montpellier Cedex 05 |
Thermodynamics;
microstructure; X-ray; SEM; microprobe |
preparation of materials |
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I1/1+2+3+4: Contribution to the constitutional and technological characterization of selected groups of lead-free alloys as soldering materials | Ferro, Prof. Riccardo
ferro@chimica.unige.it Università di Genova Dipartimento di Chimica e Chimica Industriale Via Dodecaneso, 31 I-16132 Genova |
phase diagrams of Bi, In, Sn, Zn based systems
- experimental and optimization;
thermodynamic properties; oxidation behavior; surface tension; mechanical properties |
(in cooperation with:
Univ. of Leeds - A. Watson, Univ. d'Aix-Marseille I - J.P. Bros, Omodeo - V. Cinelli, Univ. Roma - D. Gozzi, ICFAM - CNR - E. Ricci, Istituto Italiano della Saldatura - C. Rosselini) |
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PT1/1+3+4: Properties of lead-free solder alloys for the electronic industry | Castro, Prof. Fernando;
Soares, Dr. Delfim dsoares@dem.uminho.pt University of Minho PT |
Sn-Bi-Cu and Sn-Zn-Al: phase equilibria; kinetics of oxidation; wettability; mechanical properties |
Modeling of phase equilibria |
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PL1/1: Thermodynamics of Ag-In, Ag-Ga, and Ag-In-Ga liquid solutions | Fitzner, Prof. Krzysztof
nmfitzne@imim-pan.krakow.pl Lab. of Physical Chemistry, Faculty of Non-Ferrous Metals, AGH, 30 Mickiewicza Ave. PL-30-059 Kraków |
emf measurements | calorimetric measurements, DTA |
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PL3/1: Diffusion soldering - candidate for a lead-free interconnection technology | Zieba, Prof. Pawel
nmzieba@imim-pan.krakow.pl Polish Academy of Sciences Inst. of Metallurgy and Materials Science PL-XXXX Kraków |
diffusion in sandwiched layers (substrate/solder/substrate) | mechanical testing;
thermal stability |
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SLO1/1: Knudsen cell mass spectrometric determination of activities in selected binary and ternary alloys | Popovic, Dr. Arkdij
arkadij.popovic@ijs.si Jozef Stefan Institute Jamova 39 SLO-1001 Ljubljana |
Thermodynamic activities by Knudsen cell mass spectrometry | |
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YU1/1+2: Thermodynamic investigation of some Ga-based lead-free solder materials | Zivkovic, Dr. Dragana
dzmaca@ptt.yu , jmm@eunet.yu, dzivkovic@tf.bor.ac.yu Dept. of Metallurgy VJ12 Technical Faculty Univ. of Belgrade YU-19210 Bor |
thermodynamics (DSC, calorimetry);
Phase diagrams (thermal analysis, XRD) |
thermodynamic investigations |
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CH1/2+1: Theoretical modelling of phase diagrams and their experimental verification | Janczak-Rusch, Dr. Jolanta
jolanta.janczak@empa.ch EMPA Dübendorf Section Surface and Joining Technology Überlandstrasse 129 CH-8600 Dübendorf |
theoretical modelling of phase diagrams and
kinetics;
experimental verification |
thermochemical data;
alloy production; experimental verification of phase diagrams |
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CZ1/2: Theoretical study of phase diagrams of low-melting binary and ternary alloys, their preparation and characterization | Drápala, Doc. Jaromír
jaromir.drapala@vsb.cz Technical University of Ostrava tr. 17. listopadu CZ-708 33 Ostrava - Poruba |
phase diagram calculations in binary and ternary systems (Sn, Cu, Ag, Zn, In, Bi, Sb) | cooperation with researchers doing experiments |
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CZ2/2: Theoretical modeling of phase diagrams of low-melting point alloys | Vrestál, Prof. Jan
vrestal@chemi.muni.cz Dept. of Theoretical and Physical Chemistry Masaryk University Kotlárská 2 CZ-611 37 Brno |
phase diagram calculations in tin-based alloys (Sn, Cu, Ag, Zn, In, Bi, Sb) | cooperation with researchers doing experiments |
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CZ3/2+1: The theoretical modelling and experimental study of phase diagrams in selected systems for lead-free soldering | Kroupa, Dr. Ales
kroupa@ipm.cz Institute of Physics of Materials AS CR Zizkova 2 CZ-611 37 Brno |
phase diagram calculations in binary and ternary
systems (Sn, Cu, Ag, Zn, In, Bi, Sb);
EPMA; metallography |
cooperation with researchers doing experiments and theoretical assessments of multicomponent systems |
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D1/2: Development of a thermodynamic database for low melting temperature alloys as support to control environment detrimental materials | Zinkevich, Dr. Matsvei
zinkevich@mf.mpg.de MPI für Metallforschung PML Heisenbergstr. 3 D-70569 Stuttgart |
CALPHAD calculations on selected subsystems (Ag, Bi, Cu, Pb, Sb, Sn, Zn) | experimental support
(cooperation with D2/2+1, F1/1+2) |
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D13/2+1+3: Investigation of thermochemical, thermophysical and transformation properties of lead-free solders | Schneider, Prof. J.
schneider@mch.rwth-aachen.de Lehrstuhl für Werkstoffchemie RWTH Aachen Kopernikusstr. 16 D-52074 Aachen |
thermochemical properties;
thermophysical properties; calculation of surface tension and viscosity; database with kinetic coefficients |
equilibria and diffusion processes (WG 1);
surface tension, viscosity, wettability (WG 3) |
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D2/2+1: Thermodynamic modeling of stable and metastable complex solution phases as A2, B2, D03 and D82, appearing in alloys containing Ag, Bi, Cu, In, Pb, Sb, Sn, Zn | Fries, Dr. Susanna G.
s.g.fries@ access.rwth-aachen.de ACCESS e.V. Materials and Processes RWTH Aachen Intzestrasse 5 D-52072 Aachen |
thermodynamic modeling; | (cooperation with D1/2, F1/1+2) |
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CDN1/3+5: Accelerated thermal fatigue testing of Sn-Pb and Pb-free solder joints | Spelt, Prof. Jan K.
University of Toronto
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thermal fatigue;
development of models for strain, stresses, ...; influence of accelerated testing parameters ...; assessment of accuracy of available reliability models ... |
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CDN2/3+5: Microstructural characterization of lead-free Sn-Ag-Cu solder | Perovic, Prof. Doug D.
University of Toronto
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effects of Pb, Au, Ag, and Pd contamination on microstructure, thermal and mechanical propeties | |
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CH2/3+5+6: Correlation between the properties of lead-free solder materials and the overall behavior of their joints | Harzenmoser, Dr. Marc
marc.harzenmoser@empa.ch EMPA Dübendorf Section Surface and Joining Technology Überlandstrasse 129 CH-8600 Dübendorf |
mechanical tests (tensile, shear, creep, fatigue);
corrosion; non-desdtructive methods to predict joint behavior; theoretical models to predict joint behavior |
partners applying lead-free solders (microelectronics
industry);
partners experienced in modeling and testing solders |
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CH3/3+5+6: Formation of intermetallic compounds and whisker growth in lead-free solders | Egli, Dr. André
Shipley Scheiz AG
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EPMA; TEM; XRD; AFM | (in cooperation with CH2/3+5+6) |
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D3/3+6: Control of microstructure formation in lead-free solder joints - "CONTROLDER" | Schmitz, Dr. G.J.
g.j.schmitz@access.rwth-aachen.de ACCESS e.V. Materials and Processes RWTH Aachen Intzestrasse 5 D-52072 Aachen |
experimental investigation of microstructure
formation (effects of dopants);
numerical simulations |
information from WGs 1 and 2;
information on boundary conditions from WG 6 |
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D7/3+5: Determination of mechanical properties of eutectic and non eutectic lead free solder materials or solder joints depending on temperature and strain rate with regard to the microstructure. Reliability of solder joints to fatigue at low mechanical frequency depending on microstructure. Determination of crack behaviour of solder joints (flip chip) using micro waves | Villain, Prof. Jürgen
villain@lrz.uni-muenchen.de Fachbereich Elektrotechnik Fachgebiet: Werkstoffe und Fertigungsverfahren der Elektrotechnik Fachhochschule Augsburg Baumgartnerstr. 16 D-86161 Augsburg |
stress-strain, creep as a function of temperature
and strain rate;
reliability of solder joints to fatigue at low mechanical frequency |
cooperation with A3/5+3, D5/5+3, D4/5 |
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D9/3+5: Power Electronics | Lefranc, G.
guy.lefranc@mchp.siemens.de Siemens CT MS4 Otto-Hahn-Ring 6 D-81739 München |
specimen preparation;
mechanical and electrical properties of high-melting solders; modeling of creep; solder layer fatigue;
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D10/3+5: constitutive laws and fatigue properties of lead-free solders | Wiese, Dr. Steffen
wiese@ihm.et.tu-dresden.de TU Dresden Inst. f. Halbleiter- und Mikrosystemtechnik Mommsenstr. 13 D-01069 Dresden |
creep shear tests (flip chip solder joints,
PCBs);
isothermal fatigue (flip chip); microstructure of lead-free solders |
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D14/3: Influence of heat treatment on melt properties | Hoyer, Prof. Walter
hoyer@physik.tu-chemnitz.de TU Chemnitz DInstitut f. Physik D-09107 Chemnitz |
short range order and medium range
order in liquid Sn-based binary and ternary alloys (Synchrotron
radiation, neutron diffraction);
viscosity, density, surface and interfacial tension |
small-angle and wide-angle neutron scattering |
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E1/3: | Duran, Dr. J.
Amo, Dr. J.M. jduran@cenim.csic.es CENIM (CSIC) Avda. Gregorio del Amo, 8 E-28040 Madrid |
mechanical testing (tensile, shear, creep,
fatigue);
metallography, SEM |
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F4/3: The role of nanoparticles and nanodroplets in the physical and mechanical performance of industrial lead-free solders | Gasser, Prof. Jean-Georges
gasser@sciences.univ-metz.fr Laboratoire de Physique des Liquides et des Interfaces Institut de Physique et Chimie Université de Metz 1 Bd. D.F. Arago F-57078 Metz |
preparation of melts containing nanograins
or nanodroplets;
electrical and thermal cond.; diffusion; SAXS; SANS; wettability; magnetic properties; microscopy of solders on different levels; thermal expansion, tensile, shear, creep, fatigue,...; modeling |
in cooperation with 11 other laboratories in D, F, Russia(?), Ukraine(?) |
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F6/3: Microstructural and chemical evolution of lead free solder materials with elaboration and service conditions | Silvain, Dr. Jean-Francois
silvain@icmcb.u-bordeaux.fr ICMCB - CNRS 87, Av. du Dr. Albert Schweitzer F-33608 Pessac |
microstructure;
chemical characterization; correlation between microstructure and mechanical behavior; microstructure under cycling conditions |
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PL2/3+5: Lead-free solders: the effect of wetting-interface structure-bond strength interrelationship on utility properties of solder joints | Sobczak, Dr. Jerzy
sobczak@iod.krakow.pl Foundry Research Institute 73 Zakopianska St. PL-38-418 Krakow |
physical properties;
electrical properties; mechanical properties; surface tension, wetting; microstructure; reliability investigations |
Thermodynamic calculations;
HR-TEM; push-off shear tests; production of real joints under industrial conditions |
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PL4/3: Measurements of surface tension and density of the (Ag-Sn-Cu)eut+Sb alloys | Moser, Prof. Zbigniew
mmmoser@imim-pan.krakow.pl Inst. of Metallurgy and Materials Science Reymonta St. 25 PL-30-059 Kraków |
density and surface tension of
Ag-Sn-Cu-Sb (maximum bubble pressure) |
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PL5/3: Model for the formation of multi-layers structure during diffusive soldering | Wolczynski, Prof. Waldemar
nmwolczy@imim-pan.krakow.pl Inst. of Metallurgy and Materials Science Reymonta St. 25 PL-30-059 Kraków |
modeling of diffusive soldering | preparation of actual joints |
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S1/3+5+2: Wettability and reliability modelling and characterization of lead-free solders | Liu, Prof. Johan
johan.liu@me.chalmers.se Division for Electronics Production Chalmers Univ. of Technology Argongatan 30 S-431 53 Mölndal, Göteborg |
Thermodynamic assessment of Ag-Cu-O-Sn;
wettability; low-cycle fatigue life; degradation mechanisms; theoretical prediction of fatigue life |
determination of oxygen content in solders;
thermodynamic databases |
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SK1/3+5: Lead-free solder materials for joining of composite with other materials | Sebo, Dr. Pavel
ummssebo@savba.sk Inst. of Materials and Machine Mechanics Slovak Academy of Sciences Ra?ianska 75 SK-831 02 Bratislava 3 |
preparation of alloys and composites;
wettability and surface tension; metallographic study of joints; shear strength |
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UK2/3+5: Properties and life prediction of lead-free solder joints | Plumbridge, Prof. William J.
W.Plumbridge@open.ac.uk Dept. of Materials Engineering The Open university Milton Keynes MK7 6AA UK |
experimental investigation of mechanical properties
(tensile/shear, creep, fatigue, thermal cycling) in Ag-Sn, Cu-Sn, Ag-Cu-Sn;
equations for life prediction; microstructure |
Experience with large-scale PCB evaluation;
special equipment for real joint strength testing; expertise in FE modeling |
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UK3/3+5: Correlation between bulk solder properties and interconnection performance | Plumbridge, Prof. William J.
W.Plumbridge@open.ac.uk Dept. of Materials Engineering The Open university Milton Keynes MK7 6AA UK |
experimental mechanical tests on model joints and actual joints on boards - comparison of data - establishment of correlation factor | Experience with large-scale PCB evaluation;
special equipment for real joint strength testing; expertise in FE modeling |
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UK4/3+5: Constitutive relationships for the mechanical behaviour of lead-free solders | Plumbridge, Prof. William J.
W.Plumbridge@open.ac.uk Dept. of Materials Engineering The Open university Milton Keynes MK7 6AA UK |
development of history-dependent mechanistic damage equations | Experience with TEM of solder alloys |
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UK5/3+5: The role of intermetallic compounds in the performance of lead-free solder joints | Plumbridge, Prof. William J.
W.Plumbridge@open.ac.uk Dept. of Materials Engineering The Open university Milton Keynes MK7 6AA UK |
Influence of intermetallic compounds thickness
on tensile, fatigue, creep and thermomechanical fatigue behavior of model
and actual interconnections;
metallography |
Experience with large-scale PCB evaluation;
special equipment for real joint strength testing; expertise in FE modeling |
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A4/4: Environmental aspects of lead-free soldering materials | Krachler, Prof. Regina
regina.krachler@univie.ac.at Institut für Anorganische Chemie Universität Wien Währingerstr. 42 1090 Wien |
simulation of waste disposal (Ag-In-Sn; Ag-In-Pd-Sn);
mobility and chemical behavior of released metal ions; formation of organometallic In- and Sn-compounds |
Speciation of organotin and organoindium compounds
in the environment;
modeling of mobility of heavy metals in sediments and soils |
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A6/4: Environmental fate of soldering materials disposed in sanitary landfills | Lorber, Prof. Karl E.
enttech@unileoben.ac.at Inst. for Waste Management and Landfill Technologies University of Leoben Peter Tunnerstr. 15 A-8700 Leoben |
simulation of disposal of soldering
materials and electronic wastes;
mobility of heavy metals ions in soil; formation of organic and inorganic Sn-, Cu-, Ag-, and Bi-compounds |
Speciation of organotin and organoindium compounds in soil, water and sediments |
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A3/5+3: Thermo-mechanical properties of lead-free solder materials | Weiss, Prof. Brigitte
weiss@ap.univie.ac.at Inst. of Material Physics University of Vienna Strudlhofgasse 4 A-1090 Wien |
Elastic properties;
elast-plastic properties; plastic behavior; creep response; thermal strain; CTE for packaging structures ... |
cooperation with D5/5+3; cooperation with WG 3 |
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BG2/5: Numerical calculations and computer simulation of different stages of lead-free soldering process | Drenchev, Dr. Ludmil Borisov
ljudmil.d@ims.bas.bg Institute of Metal science Bulgarian Academy of Science 67, Shipchenski Prohod Street BG-1574 Sofia |
Prediction of thermal-cycle
fatigue-life and life time
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CDN3/5+6: The effect of the higher soldering temperatures required for lead-free solders on the incidence of conductive anodic filament (CAF) formation | Turbini, Dr. Laura J.
Centre for Microelectronics Assembly and Packaging
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CAF formation with different fluxes;
different test boards; effect of voltage gradient |
(close interaction with CMAP companies) |
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CDN5/5: Metallurgical reactions between lead-free solders and printed board pad finishes | Corbin, Dr. S.F.
scorbin@mecheng1.uwaterloo.ca Dept. of Mechanical Engineering University of Waterloo Waterloo, Ontario CDN |
interactions between solders and PCB metal pad finishes (in solid and liquid state) | experience with mechanical behavior of bulk solder and joint properties (creep, creep-fatigue interactions, reliability) |
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D4/5: Microstructural change in solders: computational modeling and experimental verification | Müller, Prof. Wolfgang H.
wolfgang.h.mueller@tu-berlin.de TU Berlin Fakultät V Institut für Mechanik Einsteinufer 5 D-10587 Berlin |
microstructure modeling (phase field theory,
discrete Fourier transform techniques, FE modeling);
experimental homegization techniques; nano-indentor tests; micro-fatigue tests |
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D5/5+3: Thermo-mechanical reliability of lead-free solder materials | Michel, Prof. Bernd
bernd.michel@izm.fraunhofer.de Fraunhofer Institute IZM Berlin Micro Materials Center Gustav-Meyer-Allee 25 D-13355 Berlin |
thermo-mechanical testing;
creep and fatigue tests; development of new testing methods (microdeformation behavior); thermo-mechanical simulation, fracture analysis, life-time estimations ... |
higher temperature applications;
creep laws for lead-free soldering; materials testing |
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D6/5+3+6: Thermomechanical reliability of lead-free solder materials | Auerswald, DI Ellen
ellen.auerswald@izm.fraunhofer.de Technical University Berlin Schwerpunkt Technologien der Mikroperipherik Sekr. TIB 4/2-1 Gustav-Meyer-Allee 25 D-13355 Berlin |
Fatigue and creep test;
thermal and mechanical simulation of solder materials; stress and strain analysis |
collaboration within WG 5 (esp. D5/5+3);
collaboration with WG 3 and 6 |
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D11/5+6: Processability of lead-free solder pastes & influence of assembly process parameters on the reliability of lead-free SMT solder joints | Wolter, Prof. K.J.
Hagen, DI G. wolter@iet.et.tu-dresden.de hagen@iet.et.tu-dresden.de Dresden University of Technology Electronics Technology Laboratory D-01062 Dresden |
processability of lead-free solder pastes;
mechanical prop. (shear strength) of SMT solder joints; formation of voids; flux-free soldering |
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F5/5: Reliability of lead-free solder joints | Zardini, Prof. Christian
zardini@ixl.u-bordeaux.fr Laboratoire IXL ENSEIRB Université Bordeaux 1 CNRS UMR 5128 351 Cours de la Libération F-33405 Talence Cedex |
aging experiments;
microanalysis; thermomechanical finite element simulation; modeling |
contacts with Siemens Munich (Prof. Wolfgang);
participation in HIRONDELLE project (GROWTH, FP5) |
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GR1/5: Experimental Investigation and Determination of Strain Distributions in Solder Joints Using Optical Moiré Techniques | Karalekas, Prof. Dimitris
dkara@unipi.gr Dept. of Technol. and Production Systems University of Piraeus Karaoli and Dimitriou 80 GR-185 34 Piraeus |
reliability tests by Moiré interferometry | |
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UK1/5+3: Stress analysis and measurement in soldered interconnections | Gungor, Dr. Salih
s.gungor@open.ac.ukDept. of Environmental and Mechanical Engineering The Open University Ealton Hall Milton Keynes, MK7 6AA UK |
High-resolution moiré interferometry | experiences with large scale PCB evaluation;
expertise in FE modeling |
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CDN4/6: Alternative soldering processes using transient liquid phase sintering | Corbin, Dr. S.F.
scorbin@mecheng1.uwaterloo.ca Dept. of Mechanical Engineering University of Waterloo Waterloo, Ontario CDN |
develop and study transient liquid phase sintered solder pastes for use in microelectronic packaging | experience with mechanical behavior of bulk solder and joint properties (creep, creep-fatigue interactions, reliability) |
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D8/6: Packaging and Assembly | Albrecht, Dr. J.
hans-juergen.albrecht@blns.siemens.de Siemens CT MM6, Packaging & Assembly Siemensdamm 50 D-13629 Berlin |
manufacturing preparation for PCB with lead-free
solder;
compatibility with conventional and high-integrated devices; interaction of solders with board and device metallization; test set up; process and technical reliability |
| © Materials Chemistry /
Inorganic Chemistry
e-mail
Last update 2003.02.11 |